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Calcium Hypochlorite Decanter separator
,420mm Decanter separator
,3300RPM screw decanter centrifuge
The Decanter Centrifuge for CMP Slurry Recovery is designed for continuous abrasive-solids recovery, conditioned slurry thickening, filter-feed preparation, and primary liquid clarification.
It is suitable for Chemical Mechanical Planarization processes involving silica, alumina, or ceria abrasives, as well as copper and tungsten CMP wastewater streams. CMP wastewater may contain nanoscale abrasive particles, dissolved metals, oxidizers, complexing agents, surfactants, and other process chemicals.
- Oxide CMP slurry treatment
- Silica abrasive recovery
- Ceria slurry solids recovery
- Alumina-based CMP wastewater treatment
- Copper CMP sludge thickening
- Tungsten CMP slurry treatment
- Post-coagulation solids separation
- Filter press feed preparation
- Semiconductor wastewater pretreatment
- Process-water clarification
- Metal-containing sludge concentration
- Spent polishing slurry volume reduction
Ultrafine Particles
Nanoscale CMP abrasives may remain suspended. pH adjustment, coagulation, or flocculation may be needed before centrifugation.
Different Slurry Chemistries
Oxide, copper, tungsten, and ceria CMP streams contain different abrasives and chemicals. Separate collection helps reduce cross-contamination.
Dissolved Metals
The decanter removes suspended solids but not dissolved metals. Additional precipitation, ion exchange, or membrane treatment may be required.
Contamination Control
Recovered solids may contain metals, pad debris, and mixed abrasives. Low-contamination materials can be selected for valuable material recovery.
Slurry Reuse
Recovered slurry cannot normally be reused directly. Particle size, chemistry, contamination, and polishing performance must first be verified.
CMP Slurry Recovery Solution
Peony provides continuous solutions for conditioned CMP slurry thickening, abrasive recovery, sludge reduction, and downstream treatment preparation.
CMP Tool Drain / Spent Slurry
→ Separate Collection
→ Equalization Tank
→ pH Adjustment
→ Optional Coagulation / Flocculation
→ Decanter Centrifuge
→ Thickened CMP Solids
→ Filter Press / Dryer / Metal Recovery / Disposal
Clarified Liquid
→ Intermediate Tank
→ Microfiltration / Ultrafiltration / Ion Exchange / RO
→ Process-Water Reuse or Discharge
Further membrane or polishing treatment may be required when higher water-reuse quality is needed.
Peony Can Provide
- CMP slurry testing and centrifuge selection
- Separate slurry collection system
- Equalization tank and feed pump
- pH adjustment and chemical dosing
- Adjustable bowl and differential speed
- Pond-depth and torque control
- Low-contamination and wear-resistant components
- Automatic flushing and cleaning
- Clarified-liquid collection system
- PLC and VFD control
- Filter press or polishing-treatment integration
How the Decanter Centrifuge Works
1. Conditioned CMP Slurry Feeding
Conditioned CMP slurry enters the rotating bowl through a controlled feed pipe.
An agitated equalization tank maintains a stable feed concentration and prevents settled solids from accumulating in the tank.
2. Centrifugal Sedimentation
High-speed bowl rotation separates aggregated abrasive particles, precipitated metals, and suspended solids from the liquid phase.
The denser solids move outward and form a layer against the bowl wall, while the liquid remains closer to the bowl center.
3. Continuous Solids Conveying
The internal screw conveyor rotates at a controlled differential speed.
It continuously transports the settled CMP solids toward the conical end for further thickening and discharge.
4. Clarified Liquid Discharge
The separated liquid leaves through the liquid outlet.
It can be transferred to membrane filtration, ion exchange, metal-removal treatment, water reclamation, or further wastewater treatment.
5. Thickened CMP Solids Discharge
Concentrated CMP solids are discharged continuously.
The solids can be sent to a filter press, dryer, metal-recovery process, abrasive-recovery process, sludge container, or controlled disposal.
| Model | Diameter (mm) | Length (mm) | Length-to-diameter rate | G force | Max solid discharge (m³/h) | Weight (kg) | Dimension (L*W*H) (mm) |
|---|---|---|---|---|---|---|---|
| PDC-10 | 250 | 1000 | 4 | 4080 | 0.4 | 1000 | 2410*800*1080 |
| PDC-12 | 4200 | 1350 | 4 | 3500 | 0.6 | 1200 | 2610*800*1080 |
| PDC-12 | 4200 | 1350 | 4.5 | 3180 | 1.2 | 1800 | 3495*840*1180 |
| PDC-18 | 4000 | 1600 | 4.5 | 3180 | 1.2 | 3200 | 3497*1020*1385 |
| PDC-18 | 450 | 2150 | 4 | 2500 | 2 | 3800 | 4447*1080*1385 |
| PDC-20 | 400 | 2250 | 4.5 | 2500 | 3.5 | 4000 | 4580*1140*1470 |
| PDC-21 | 530 | 2280 | 4.3 | 2500 | 5 | 5000 | 4924*1170*1540 |
| PDC-26 | 655 | 2800 | 4.3 | 2270 | 8 | 7000 | 4300*1900*1350 |
Main Advantages
Continuous CMP Sludge Thickening
The decanter continuously concentrates conditioned CMP solids and reduces the volume sent to filter presses or sludge-handling systems.
Reduced Downstream Filtration Load
Primary separation removes aggregated abrasive particles and precipitated solids before membrane filtration or polishing treatment.
Separate Recovery of Valuable Streams
Oxide, copper, tungsten, and ceria CMP streams can be collected separately to support metal or abrasive recovery.
Stable Automatic Operation
Bowl speed, differential speed, pond depth, feed rate, and conveyor torque can be adjusted according to changing slurry conditions.
Low-Contamination Configuration
Internal materials and protection components can be selected according to abrasive type, metal contamination limits, and downstream recovery requirements.
Please provide:
- CMP stream and abrasive type
- Particle size and solids concentration
- Slurry density, viscosity, and flow rate
- Temperature, pH, and conductivity
- Dissolved metals and chemical additives
- Current coagulant or flocculant
- Recovery target and clarified-liquid requirement
- Water-reuse and downstream treatment process
Can the decanter directly recover nanoscale CMP abrasive particles?
Not always. Nanoscale silica, ceria, and alumina particles may remain colloidally stable. Coagulation or flocculation is commonly evaluated before centrifugal separation.
Can recovered CMP solids be returned directly to the polishing tool?
Normally not without further purification and testing. Particle size, agglomeration, chemical composition, metal contamination, polishing performance, and wafer-defect risk must first be confirmed.
Can one centrifuge treat oxide and metal CMP wastewater?
Technically possible, but separate collection is recommended when cross-contamination, metal recovery, or abrasive reuse is important.
Can clarified liquid be reused in semiconductor production?
It may be reused after further treatment. Membrane filtration, ion exchange, RO, or polishing treatment may be required to meet the specified water-quality standard.
Does the decanter replace a filter press or membrane system?
No. The decanter mainly provides continuous primary separation and slurry thickening. A filter press may still be required for lower cake moisture, while membranes may be required for higher liquid clarity.
Peony welcomes distributor and agent cooperation with semiconductor manufacturers, wafer fabrication plants, CMP slurry suppliers, electronics wastewater contractors, metal-recovery companies, water-reclamation integrators, and industrial separation partners.
We support partners with CMP slurry testing, centrifuge selection, chemical-conditioning design, low-contamination configuration, metal and abrasive recovery integration, water-reclamation connection, installation guidance, commissioning, spare parts, and after-sales service.
Send us your CMP slurry information, including the polishing process, abrasive type, particle size, solids concentration, dissolved-metal content, required capacity, recovery target, clarified-liquid standard, and downstream treatment arrangement. Our engineering team will recommend a suitable decanter centrifuge solution for your CMP slurry recovery process.
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